Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468367 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2019-11-05 |
| 10381288 | Packaged semiconductor die and CTE-engineering die pair | — | 2019-08-13 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chia-Pin Chiu, Johanna M. Swan | 2019-04-09 |