BW

Bo Wen

SC Sanechips Technology Co.: 1 patents #3 of 55Top 6%
TE Tencent: 1 patents #385 of 1,350Top 30%
IBM: 1 patents #5,496 of 11,143Top 50%
Overall (2019): #96,876 of 560,194Top 20%
3
Patents 2019

Issued Patents 2019

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10490525 High speed handling of ultra-small chips by selective laser bonding and debonding Qianwen Chen, Bing Dang, Russell A. Budd, Li-Wen Hung, Jae-Woong Nah +1 more 2019-11-26
10481957 Processor and task processing method therefor, and storage medium Qingxin Cao 2019-11-19
10313278 Contact matching method, instant messaging client, server and system Xiaoqiang Chen, Kai Xie 2019-06-04