Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354974 | Structure and formation method of chip package structure | Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng | 2019-07-16 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng | 2019-01-22 |