Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10505102 | Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole | Volker Strutz, Klaus Elian, Cyrus Ghahremani | 2019-12-10 |
| 10451543 | Integrated photo-acoustic gas sensor module | Thomas Mueller, Horst Theuss, Klaus Elian, Stefan Kolb | 2019-10-22 |
| 10304795 | Semiconductor device including antistatic die attach material | Volker Strutz, Franz-Peter Kalz | 2019-05-28 |
| 10241088 | Photo-acoustic gas sensor module having light emitter and detector units | Horst Theuss, Gottfried Beer, Sebastian Beer, Alfons Dehe, Franz Jost +2 more | 2019-03-26 |
| 10180468 | Chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package | Goran Keser, Manuel Harrant | 2019-01-15 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more | 2019-01-01 |