Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438878 | Package with component connected with carrier via spacer particles | Manfred Schindler, Volker Strutz | 2019-10-08 |
| 10370244 | Deposition of protective material at wafer level in front end for early stage particle and moisture protection | Florian BRANDL, Manfred Fries | 2019-08-06 |
| 10304795 | Semiconductor device including antistatic die attach material | Volker Strutz, Rainer Markus Schaller | 2019-05-28 |