Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522438 | Package structure having under ball release layer and manufacturing method thereof | Chun-Yi Cheng, Wei-Yuan Cheng, Yu-Jhen Yang | 2019-12-31 |
| 10461035 | Semiconductor package structure | Wei-Yuan Cheng, Chen-Tsai Yang, Jie-Mo Lin | 2019-10-29 |
| 10366965 | Chip bonding apparatus, chip bonding method and a chip package structure | Wei-Yuan Cheng, Shau-Fei Cheng | 2019-07-30 |
| 10249567 | Redistribution layer structure of semiconductor package | Jie-Mo Lin, Wei-Yuan Cheng, Chen-Tsai Yang | 2019-04-02 |