Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461035 | Semiconductor package structure | Shu-Wei Kuo, Wei-Yuan Cheng, Chen-Tsai Yang | 2019-10-29 |
| 10249567 | Redistribution layer structure of semiconductor package | Shu-Wei Kuo, Wei-Yuan Cheng, Chen-Tsai Yang | 2019-04-02 |