Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461035 | Semiconductor package structure | Shu-Wei Kuo, Wei-Yuan Cheng, Jie-Mo Lin | 2019-10-29 |
| 10384434 | Separating device and separating method | Ko-Chin Yang, Shi-Chang Chen, Cheng-Yi Wang, Yen-Ting Wu | 2019-08-20 |
| 10249567 | Redistribution layer structure of semiconductor package | Jie-Mo Lin, Shu-Wei Kuo, Wei-Yuan Cheng | 2019-04-02 |