Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522438 | Package structure having under ball release layer and manufacturing method thereof | Wei-Yuan Cheng, Shu-Wei Kuo, Yu-Jhen Yang | 2019-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522438 | Package structure having under ball release layer and manufacturing method thereof | Wei-Yuan Cheng, Shu-Wei Kuo, Yu-Jhen Yang | 2019-12-31 |