Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504816 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Christopher G. Malone, Gregory P. Imwalle | 2019-12-10 |
| 10468359 | Package stiffener for protecting semiconductor die | William Frank Edwards, Erick Tuttle, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2019-11-05 |
| 10440862 | Data center coolant switch | Pritish R. Parida, Mark D. Schultz | 2019-10-08 |
| 10342165 | Data center coolant switch | Pritish R. Parida, Mark D. Schultz | 2019-07-02 |
| 10244665 | Effectiveness-weighted control of cooling system components | Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more | 2019-03-26 |
| 10238009 | Coolant and ambient temperature control for chillerless liquid cooled data centers | Timothy J. Chainer, Milnes P. David, Pritish R. Parida, Robert E. Simons | 2019-03-19 |