Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504816 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Madhusudan K. Iyengar, Gregory P. Imwalle | 2019-12-10 |
| 10492329 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2019-11-26 |
| 10492340 | Managing dependencies between data center computing and infrastructure | Thomas R. Kowalski, Ankit Somani | 2019-11-26 |
| 10440861 | Evaporative induction cooling system for a data center | Andrew B. Carlson, Jimmy Clidaras | 2019-10-08 |
| 10404322 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2019-09-03 |
| 10306797 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2019-05-28 |