MD

Milnes P. David

IBM: 11 patents #396 of 11,143Top 4%
Overall (2019): #7,028 of 560,194Top 2%
11
Patents 2019

Issued Patents 2019

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
10299409 Protective louver assembly for air-moving assembly Levi A. Campbell, Christopher R. Ciraulo, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt 2019-05-21
10287925 Fuel vaporization using data center waste heat Levi A. Campbell, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons 2019-05-14
10265812 Liquid-cooled, composite heat sink assemblies Dylan J. Boday, Levi A. Campbell, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt +3 more 2019-04-23
10271459 Protective cover assembly for air-moving assembly Levi A. Campbell, Christopher R. Ciraulo, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt 2019-04-23
10257599 Slack and strain control mechanism Wiren D. Becker, Marc H. Coq, Ryan Elsasser, Syed F. Hossain 2019-04-09
10249555 Composite heat sink structures Levi A. Campbell, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons 2019-04-02
10247489 Structural dynamic heat sink Bjorn J. Ahbel, Wiren D. Becker, Marc H. Coq, Ryan Elsasser, Syed F. Hossain 2019-04-02
10244665 Effectiveness-weighted control of cooling system components Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more 2019-03-26
10238009 Coolant and ambient temperature control for chillerless liquid cooled data centers Timothy J. Chainer, Madhusudan K. Iyengar, Pritish R. Parida, Robert E. Simons 2019-03-19
10231357 Two-phase cooling with ambient cooled condensor Timothy J. Chainer, Pritish R. Parida 2019-03-12
10169624 Tamper-proof electronic packages with two-phase dielectric fluid Levi A. Campbell, Dustin W. Demetriou, Michael J. Ellsworth, Jr. 2019-01-01