Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10499543 | Two-phase liquid cooled electronics | Timothy J. Chainer, Mark D. Schultz | 2019-12-03 |
| 10499541 | Cold plate device for a two-phase cooling system | Timothy J. Chainer, Fanghao Yang | 2019-12-03 |
| 10440862 | Data center coolant switch | Madhusudan K. Iyengar, Mark D. Schultz | 2019-10-08 |
| 10423735 | Hybrid modeling for a device under test associated with a two-phase cooling system | Timothy J. Chainer | 2019-09-24 |
| 10382670 | Cognitive recording and sharing | Elisabeth Andreassen, Avery W. Hagleitner, Andrew R. Ranck | 2019-08-13 |
| 10371461 | Multi-layered counterflow expanding microchannel cooling architecture and system thereof | Timothy J. Chainer, Fanghao Yang | 2019-08-06 |
| 10342165 | Data center coolant switch | Madhusudan K. Iyengar, Mark D. Schultz | 2019-07-02 |
| 10317962 | Inducing heterogeneous microprocessor behavior using non-uniform cooling | Pradip Bose, Alper Buyuktosunoglu, Timothy J. Chainer, Augusto J. Vega | 2019-06-11 |
| 10306801 | Cold plate device for a two-phase cooling system | Timothy J. Chainer, Fanghao Yang | 2019-05-28 |
| 10244655 | Two-phase liquid cooled electronics | Timothy J. Chainer, Mark D. Schultz | 2019-03-26 |
| 10244654 | Cold plate with combined inclined impingement and ribbed channels | — | 2019-03-26 |
| 10238009 | Coolant and ambient temperature control for chillerless liquid cooled data centers | Timothy J. Chainer, Milnes P. David, Madhusudan K. Iyengar, Robert E. Simons | 2019-03-19 |
| 10231359 | Active control for two-phase cooling | Timothy J. Chainer, Joel A. Silberman | 2019-03-12 |
| 10231357 | Two-phase cooling with ambient cooled condensor | Timothy J. Chainer, Milnes P. David | 2019-03-12 |
| 10225952 | Cooling systems for cooling electronic components | Timothy J. Chainer | 2019-03-05 |
| 10199309 | Distribution and stabilization of fluid flow for interlayer chip cooling | Timothy J. Chainer, Fanghao Yang | 2019-02-05 |
| 10170392 | Wafer level integration for embedded cooling | Timothy J. Chainer, Mark D. Schultz | 2019-01-01 |