Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211147 | Metal-insulator-metal capacitors with dielectric inner spacers | Xunyuan Zhang, Chanro Park, Lei Sun, Yi Qi | 2019-02-19 |
| 10199264 | Self aligned interconnect structures | Xunyuan Zhang, Hoon Kim | 2019-02-05 |
| 10181420 | Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias | Jason E. Stephens, David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski +6 more | 2019-01-15 |