Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10176972 | Plasma etching apparatus comprising a nozzle oscillating unit | Yoshio Watanabe, Hiroyuki Takahashi, Takeshi Seki | 2019-01-08 |
| 10177004 | Method of processing wafer | Yoshio Watanabe, Kenji Okazaki, Hiroyuki Takahashi, Yoshiteru Nishida, Satoshi Kumazawa | 2019-01-08 |