KO

Kenji Okazaki

DI Disco: 1 patents #35 of 104Top 35%
📍 Tokyo, NJ: #12 of 26 inventorsTop 50%
Overall (2019): #386,674 of 560,194Top 70%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10177004 Method of processing wafer Yoshio Watanabe, Siry Milan, Hiroyuki Takahashi, Yoshiteru Nishida, Satoshi Kumazawa 2019-01-08