Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354919 | Wafer dividing method | Tomotaka Tabuchi, Kentaro Odanaka, Senichi Ryo, Yuki Ogawa | 2019-07-16 |
| 10177004 | Method of processing wafer | Yoshio Watanabe, Siry Milan, Kenji Okazaki, Hiroyuki Takahashi, Yoshiteru Nishida | 2019-01-08 |