Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354919 | Wafer dividing method | Tomotaka Tabuchi, Satoshi Kumazawa, Senichi Ryo, Yuki Ogawa | 2019-07-16 |
| 10207362 | Laser processing apparatus | Wataru Odagiri, Taku Iwamoto, Hironari Ohkubo, Shuichiro Tsukiji, Kouichi Nehashi +1 more | 2019-02-19 |