Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475676 | Workpiece processing method | Akiko Kigawa | 2019-11-12 |
| 10319593 | Wafer thinning method | Kazuya Hirata, Yoko Nishino, Hiroshi Morikazu | 2019-06-11 |
| 10312099 | Wafer processing method | Kazuma Sekiya | 2019-06-04 |
| 10256148 | Method of processing wafer | — | 2019-04-09 |
| 10242913 | Method of processing a wafer and wafer processing system | Hitoshi Hoshino | 2019-03-26 |