KS

Kazuma Sekiya

DI Disco: 14 patents #1 of 104Top 1%
Overall (2019): #4,396 of 560,194Top 1%
14
Patents 2019

Issued Patents 2019

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
10522503 Method of manufacturing stacked wafer assembly 2019-12-31
10515421 Human resources management system 2019-12-24
10475681 Chip accommodation tray 2019-11-12
10464329 Liquid container and liquid supply apparatus 2019-11-05
10460974 Wafer processing method and adhesive tape 2019-10-29
10446403 Wafer processing method and cutting apparatus 2019-10-15
10403490 Wafer processing method 2019-09-03
10358217 Human transporting drone 2019-07-23
10332777 Wafer processing method 2019-06-25
10328547 Grinding apparatus and wafer processing method 2019-06-25
10312099 Wafer processing method Karl Heinz Priewasser 2019-06-04
10177034 Wafer processing method 2019-01-08
10175204 Method of sorting chips Hiroshi Morikazu 2019-01-08
10170379 Wafer processing system 2019-01-01