Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483149 | Wafer processing method for dividing a wafer, including a shield tunnel forming step | — | 2019-11-19 |
| 10319593 | Wafer thinning method | Kazuya Hirata, Yoko Nishino, Karl Heinz Priewasser | 2019-06-11 |
| 10207369 | Method for forming a laser processed hole | Keiji Nomaru | 2019-02-19 |
| 10175204 | Method of sorting chips | Kazuma Sekiya | 2019-01-08 |