HH

Hitoshi Hoshino

DI Disco: 2 patents #9 of 104Top 9%
Overall (2019): #167,701 of 560,194Top 30%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10242913 Method of processing a wafer and wafer processing system Karl Heinz Priewasser 2019-03-26
10211076 Wafer processing method Toshio Tsuchiya 2019-02-19