Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475763 | Die bonding apparatus comprising an inert gas environment | Siu Wing LAU, Kin Yik Hung, Yuk Cheung Au, Leo Man Lee, Sai Yuen Go | 2019-11-12 |
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Kin Fung Yu +1 more | 2019-06-04 |
| 10192761 | Pick arm comprising a winged part for a bonding apparatus | Kin Fung Yu, Yu Xing Cao, Kai Siu LAM, Gary Peter Widdowson, Ying Zhuo Liu | 2019-01-29 |