Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu +1 more | 2019-06-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu +1 more | 2019-06-04 |