Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Chuek Wah Tang, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu +1 more | 2019-06-04 |
| 10192847 | Rapid cooling system for a bond head heater | Lu Ma, Cheuk Wah Tang | 2019-01-29 |