YA

Yuk Cheung Au

AP Asm Technology Singapore Pte: 1 patents #11 of 60Top 20%
Overall (2019): #207,807 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10475763 Die bonding apparatus comprising an inert gas environment Siu Wing LAU, Kin Yik Hung, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go 2019-11-12