Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10493590 | Selection of polishing parameters to generate removal or pressure profile | Huanbo Zhang, King Yi Heung, Nathan Bohannon, Qing Zhang | 2019-12-03 |
| 10434623 | Local area polishing system and polishing pad assemblies for a polishing system | Eric Lau, Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou +3 more | 2019-10-08 |
| 10252397 | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes | David Masayuki Ishikawa, Jeonghoon Oh, Charles C. Garretson, Huanbo Zhang, Chia-Ling PAI +2 more | 2019-04-09 |