Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350728 | System and process for in situ byproduct removal and platen cooling during CMP | Jie Diao, Erik S. Rondum, Thomas Li, Bum Jick Kim | 2019-07-16 |
| 10322492 | Retaining ring for CMP | Andrew J. Nagengast, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang +3 more | 2019-06-18 |