Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350728 | System and process for in situ byproduct removal and platen cooling during CMP | Jie Diao, Thomas Li, Bum Jick Kim, Christopher Heung-Gyun Lee | 2019-07-16 |
| 10322492 | Retaining ring for CMP | Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao +3 more | 2019-06-18 |