Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350728 | System and process for in situ byproduct removal and platen cooling during CMP | Jie Diao, Erik S. Rondum, Thomas Li, Christopher Heung-Gyun Lee | 2019-07-16 |
BK
Bum Jick Kim
Overall (2019): #521,485 of 560,194Top 95%
1
Patents 2019