Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Sara Carniello, Hubert Enichlmair, Jochen Kraft, Bernhard Loeffler, Rainer Holzhaider | 2019-11-05 |
| 10340254 | Method of producing an interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Martin Schrems | 2019-07-02 |
| 10332931 | Semiconductor device for wafer-scale integration | Cathal Cassidy, Joerg Siegert | 2019-06-25 |
| 10283541 | Semiconductor device comprising an aperture array and method of producing such a semiconductor device | Joerg Siegert, Martin Schrems | 2019-05-07 |
| 10256147 | Dicing method | Martin Schrems, Bernhard Stering | 2019-04-09 |
| 10243017 | Sensor chip stack and method of producing a sensor chip stack | Georg Parteder, Jochen Kraft, Thomas Troxler, Andreas Fitzi | 2019-03-26 |