Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Franz Schrank, Sara Carniello, Hubert Enichlmair, Bernhard Loeffler, Rainer Holzhaider | 2019-11-05 |
| 10340254 | Method of producing an interposer-chip-arrangement for dense packaging of chips | Martin Schrems, Franz Schrank | 2019-07-02 |
| 10243017 | Sensor chip stack and method of producing a sensor chip stack | Georg Parteder, Franz Schrank, Thomas Troxler, Andreas Fitzi | 2019-03-26 |