Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Franz Schrank, Sara Carniello, Hubert Enichlmair, Jochen Kraft, Rainer Holzhaider | 2019-11-05 |