Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256147 | Dicing method | Martin Schrems, Franz Schrank | 2019-04-09 |
| 10217715 | Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device | Martin Schrems, Harald Etschmaier | 2019-02-26 |