Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490719 | Die bond pad design to enable different electrical configurations | Wen-Lang Yu, Oleg Borisovich Shchekin, Franklin J. Wall, Jr., Kuochou Tai, Mohiuddin Mala +2 more | 2019-11-26 |
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2019-01-01 |