Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Daniel A. Steigerwald | 2019-01-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Daniel A. Steigerwald | 2019-01-01 |