Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiaffino | 2019-01-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiaffino | 2019-01-01 |