Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490719 | Die bond pad design to enable different electrical configurations | Wen-Lang Yu, Oleg Borisovich Shchekin, Franklin J. Wall, Jr., Mohiuddin Mala, Robert Andrew Zona +2 more | 2019-11-26 |