Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9869712 | Method and system for detecting defects of wafer by wafer sort | Tuung Luoh, I-Jen Huang, Ta-Hone Yang, Kuang-Chao Chen | 2018-01-16 |
| 9870982 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Chanh Tran, Ying Ji | 2018-01-16 |