Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026666 | Stacked die package with aligned active and passive through-silicon vias | Nitin Juneja, Wendemagegnehu Beyene, Ely Tsern | 2018-07-17 |
| 9870982 | Distributed on-chip decoupling apparatus and method using package interconnect | Ling Yang, Chanh Tran, Ying Ji | 2018-01-16 |