Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026666 | Stacked die package with aligned active and passive through-silicon vias | Wendemagegnehu Beyene, David A. Secker, Ely Tsern | 2018-07-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026666 | Stacked die package with aligned active and passive through-silicon vias | Wendemagegnehu Beyene, David A. Secker, Ely Tsern | 2018-07-17 |