Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870982 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Ling Yang, Ying Ji | 2018-01-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870982 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Ling Yang, Ying Ji | 2018-01-16 |