Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9875912 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +1 more | 2018-01-23 |