Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165677 | Bare die integration with printed components on flexible substrate without laser cut | Tse Nga Ng, Brent S. Krusor, Gregory Whiting, Steven E. Ready, Janos Veres | 2018-12-25 |
| 10147702 | Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste | Brent S. Krusor | 2018-12-04 |
| 10141668 | Detachable flex-to-flex electrical connection | David Eric Schwartz, Brent S. Krusor | 2018-11-27 |
| 9952082 | Printed level sensor | David Eric Schwartz, Yunda Wang, Robert A. Street, Janos Veres, Gregory Whiting +2 more | 2018-04-24 |
| 9947611 | Through hole arrays for flexible layer interconnects | Brent S. Krusor, David K. Biegelsen | 2018-04-17 |
| 9874984 | Printed double-wrapped coil on paper for projective capacitance sensing | Tse Nga Ng, Janos Veres | 2018-01-23 |