Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165677 | Bare die integration with printed components on flexible substrate without laser cut | Ping Mei, Tse Nga Ng, Brent S. Krusor, Gregory Whiting, Janos Veres | 2018-12-25 |
| 9952082 | Printed level sensor | David Eric Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres +2 more | 2018-04-24 |