Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165677 | Bare die integration with printed components on flexible substrate without laser cut | Ping Mei, Brent S. Krusor, Gregory Whiting, Steven E. Ready, Janos Veres | 2018-12-25 |
| 10043605 | Sensors comprising palladium complex ink | Sivkheng Kor, Yiliang Wu | 2018-08-07 |
| 10020457 | Circuit layout for thin film transistors in series or parallel | David Eric Schwartz, Janos Veres | 2018-07-10 |
| 9952082 | Printed level sensor | David Eric Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres +2 more | 2018-04-24 |
| 9874984 | Printed double-wrapped coil on paper for projective capacitance sensing | Ping Mei, Janos Veres | 2018-01-23 |