Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165677 | Bare die integration with printed components on flexible substrate without laser cut | Ping Mei, Tse Nga Ng, Gregory Whiting, Steven E. Ready, Janos Veres | 2018-12-25 |
| 10147702 | Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste | Ping Mei | 2018-12-04 |
| 10141668 | Detachable flex-to-flex electrical connection | Ping Mei, David Eric Schwartz | 2018-11-27 |
| 10109410 | Out of plane structures and methods for making out of plane structures | Christopher L. Chua | 2018-10-23 |
| 9947611 | Through hole arrays for flexible layer interconnects | Ping Mei, David K. Biegelsen | 2018-04-17 |
| 9912121 | Gap distributed Bragg reflectors | Thomas Wunderer, Christopher L. Chua, Noble M. Johnson | 2018-03-06 |