Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9982338 | High-throughput system and method for post-implantation single wafer warm-up | Tsun-Jen Chan, Cheng-Hung Hu, Kang Hua Chang, Ming-Te Chen | 2018-05-29 |
YC
Yi-Hann Chen
Overall (2018): #185,625 of 503,207Top 40%
1
Patents 2018