Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9982338 | High-throughput system and method for post-implantation single wafer warm-up | Tsun-Jen Chan, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen | 2018-05-29 |
CH
Cheng-Hung Hu
Overall (2018): #460,766 of 503,207Top 95%
1
Patents 2018