Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049856 | High temperature intermittent ion implantation | Hsin-Wei Wu, Chun-Feng Nieh, Yu Chi-Fu, Hsing-Jui Lee | 2018-08-14 |
| 9982338 | High-throughput system and method for post-implantation single wafer warm-up | Cheng-Hung Hu, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen | 2018-05-29 |